This book describes the most frequently used high-speed serial buses in embedded systems, especially those used by FPGAs. These buses employ SerDes, JESD204, SRIO, PCIE, Aurora and SATA protocols for chip-to-chip and board-to-board communication, and CPCIE, VPX, FC and Infiniband protocols for inter-chassis communication. For each type, the book provides the bus history and version info, while also assessing its advantages and limitations. Furthermore, it offers a detailed guide to implementing these buses in FPGA design, from the physical layer and link synchronization to the frame format and application command. Given its scope, the book offers a valuable resource for researchers, R&D engineers and graduate students in computer science or electronics who wish to learn the protocol principles, structures and applications of high-speed serial buses.High-speed Serial Buses in Embedded Systems is written by Feng Zhang and published by Springer. ISBNs for High-speed Serial Buses in Embedded Systems are 9789811518683, 9811518688 and the print ISBNs are 9789811518676, 981151867X.
High-speed Serial Buses in Embedded Systems
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High-speed Serial Buses in Embedded Systems
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This book describes the most frequently used high-speed serial buses in embedded systems, especially those used by FPGAs. These buses employ SerDes, JESD204, SRIO, PCIE, Aurora and SATA protocols for chip-to-chip and board-to-board communication, and CPCIE, VPX, FC and Infiniband protocols for inter-chassis communication. For each type, the book provides the bus history and version info, while also assessing its advantages and limitations. Furthermore, it offers a detailed guide to implementing these buses in FPGA design, from the physical layer and link synchronization to the frame format and application command. Given its scope, the book offers a valuable resource for researchers, R&D engineers and graduate students in computer science or electronics who wish to learn the protocol principles, structures and applications of high-speed serial buses.Product details Publisher: Springer; 1 edition (January 3, 2020) Publication Date: January 3, 2020
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